[{"insert":"常见IGBT模块失效情况的分类\n"},{"attributes":{"color":"var(--weui-FG-2)"},"insert":"失效分析 赵工"},{"insert":" "},{"attributes":{"color":"var(--weui-LINK)"},"insert":"半导体工程师"},{"insert":" "},{"attributes":{"color":"var(--weui-FG-2)"},"insert":"2023-08-03 09:42"},{"insert":" "},{"attributes":{"color":"var(--weui-FG-2)"},"insert":"发表于北京"},{"insert":"\n\nIGBT模块因应电力电子技术的迅速发展目前已经得到广泛应用，但部分模块在实际应用中也不可避免的出现了失效现象。本文简要的对模块失效的成因进行分类，主要涉及模块过温、过电压、机械损伤、器件问题造成IGBT模块的失效。"},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"align":"center"},"insert":"\n"},{"attributes":{"bold":true},"insert":"过温"},{"attributes":{"align":"justify"},"insert":"\n\n"},{"attributes":{"bold":true},"insert":"散热性不佳："},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"①模块和散热器之间安装不够紧密"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"②散热器表面平整度差"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"③导热硅脂不足、过量或则不均匀"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"④风扇老化导致转速减小或者停转"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"⑤散热器体积过小"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"⑥环境温度过高"},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"bold":true},"insert":"功耗过大："},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"①驱动电压不足，导致饱和压降增加。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"②模块开关频率过大"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"③门极驱动电阻过大，导致开关损耗增加。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"④过电流（过载等）"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"⑤短路：Ⅰ.死区时间不足；Ⅱ.驱动信号误动作。"},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"bold":true},"insert":"过电压"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":{"image":"https://files.eteforum.com/202308/3cf0c39b8ee47058.png"}},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"bold":true},"insert":"集电极过电压："},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"①模块的余量不足，导致电源电压超过模块的最大承受电压。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"②制动单元设计无法匹配或失效，总线直流电压出现异常攀升。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"③母线寄生电感过大"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"④控制信号异常"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"⑤开通速度过快"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"⑥雷电浪涌"},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"bold":true},"insert":"门极过电压："},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"①门极驱动供电异常"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"②门极回路异常"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"③雷电浪涌电压"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"④门极电压发生振荡"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"⑤门极静电击穿"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"⑥开关速度太快导致门极电压抬升"},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"bold":true},"insert":"机械损伤"},{"attributes":{"align":"justify"},"insert":"\n\n"},{"insert":"①模块主端子使用的螺栓过长导致端子的底部结构损坏"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"②主端子与外接器件之间的瞬间扭力过大"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"③模块和散热器之间的紧固扭力过大"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"④模块和散热器之间紧固扭力的不平衡导致模块绝缘基板的变形"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"⑤焊接温度太高且时间太长，导致IGBT模块内部焊接点上的焊锡融化。"},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"bold":true},"insert":"器件问题"},{"attributes":{"align":"justify"},"insert":"\n\n"},{"insert":"①IGBT芯片制造缺陷"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"②模块制造缺陷"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"来源：艾邦半导体网"},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"color":"var(--weui-FG-0)"},"insert":"半导体工程师"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"半导体经验分享，半导体成果交流，半导体信息发布。半导体行业动态，半导体从业者职业规划，芯片工程师成长历程。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"\n"}]
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发表于 2023-08-03 10:27
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