芯片失效分析及检测、加工手段及常用设备

[{"attributes":{"color":"#576b95"},"insert":"半导体工程师"},{"insert":" "},{"attributes":{"color":"var(--weui-FG-2)"},"insert":"2023-03-15 09:23"},{"insert":" "},{"attributes":{"color":"var(--weui-FG-2)"},"insert":"发表于北京"},{"insert":"\n"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"失效从失效模式和失效机理一般分类为：断裂失效分（应力腐蚀、高温应力断裂、疲劳断裂等）、非断裂失效（基本为磨损失效、腐蚀失效、变形效）、复合失效机理（多种失效机理综合作用而成导致的失效）。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":" 失效分析一般根据失效模式和现象，通过分析和验证，模拟重现失效的现象，找出失效的原因，挖掘出失效的机理的活动。在提高产品质量，技术开发、改进，产品修复及仲裁失效事故等方面具有很强的实际意义。其方法分为有损分析，无损分析，物理分析，化学分析等。  "},{"attributes":{"align":"justify"},"insert":"\n\n"},{"attributes":{"bold":true},"insert":"失效分析的意义"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"1、失效分析是确定芯片失效机理的必要手段。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"2、失效分析为工艺不断改进或者迭代优化修复芯片的设计。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"3、失效分析为有效的故障诊断提供了必要的证据支持。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"4、为生产测试提供必要的环节补充，提供必要的信息基础。"},{"attributes":{"align":"justify"},"insert":"\n\n"},{"attributes":{"bold":true},"insert":"失效分析流程一般是什么？"},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"align":"center"},"insert":"\n"},{"insert":{"image":"https://files.eteforum.com/202303/bea63bd93926cb87.png"}},{"attributes":{"align":"justify"},"insert":"\n\n\n"},{"attributes":{"bold":true},"insert":"主要步骤和内容常用设备"},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"bold":true},"insert":"1、开封"},{"insert":"：去除IC封胶，同时保持芯片功能的完整无损，保持die，bondpads，bond wires乃至lead-frame不受损伤，为下一步芯片失效分析实验做准备。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":{"image":"https://files.eteforum.com/202303/7e1f83515b5e7a33.png"}},{"attributes":{"align":"center"},"insert":"\n"},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"bold":true},"insert":"2、EMMI侦测"},{"insert":"：EMMI微光显微镜是一种效率极高的失效分错析工具，提供高灵敏度非破坏性的故障定位方式，可侦测和定位非常微弱的发光（可见光及近红外光），由此捕捉各种元件缺陷或异常所产生的漏电流可见光。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":{"image":"https://files.eteforum.com/202303/aca1902503248689.png"}},{"attributes":{"align":"center"},"insert":"\n"},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"bold":true},"insert":"3、OBIRCH应用"},{"insert":"：OBIRCH常用于芯片内部高阻抗及低阻抗分析，线路漏电路径分析。利用OBIRCH方法，可以有效地对电路中缺陷定位，如线条中的空洞、通孔下的空洞。通孔底部高阻区等，也能有效的检测短路或漏电,是发光显微技术的有力补充。"},{"attributes":{"align":"justify"},"insert":"\n\n"},{"attributes":{"bold":true},"insert":"4、X-Ray 无损侦测"},{"insert":"：检测IC封装中的各种缺陷如层剥离、爆裂、空洞以及打线的完整性，PCB制程中可能存在的缺陷如对齐不良或桥接，开路、短路或不正常连接的缺陷，封装中的锡球完整性。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":{"image":"https://files.eteforum.com/202303/d6013cf11c74c972.png"}},{"attributes":{"align":"center"},"insert":"\n"},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"bold":true},"insert":"5、SAM (SAT)超声波探伤"},{"insert":"：可对IC封装内部结构进行非破坏性检测, 有效检出因水气或热能所造成的各种破坏如：晶元面脱层、锡球、晶元或填胶中的裂缝、封装材料内部的气孔，各种孔洞如晶元接合面、锡球、填胶等处的孔洞。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":{"image":"https://files.eteforum.com/202303/a116b87b007e1630.png"}},{"attributes":{"align":"center"},"insert":"\n"},{"insert":{"image":"https://files.eteforum.com/202303/c1b723fadbd18c0f.png"}},{"attributes":{"align":"center"},"insert":"\n"},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"bold":true},"insert":"6、切片分析"},{"insert":"：对线路板上电子元器件的焊接质量进行检测，对电子元器件进行截面焊点微结构、润湿问题、空洞、裂纹等显微观察。"},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"align":"center"},"insert":"\n"},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"bold":true},"insert":"半导体实验室服务能力"},{"attributes":{"align":"justify"},"insert":"\n\n"},{"attributes":{"bold":true},"insert":"设备服务项目"},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"bold":true},"insert":"用途"},{"insert":"X-Ray2D X-Ray2D扫描，查找缺陷3D X-Ray3D扫描，空间失效点定位，或封装材料分层"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"EMMI微光显微镜侦测IC内部所放出光子，定位失效点"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"OBIRCHIR-OBIRCH用于定位失效点研磨抛光金相切片通过磨抛系统，使得失效位置的金相结构显露出来"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"CP+SEMTEM分析透射电子显微镜FIB+TEM+EDXFIB集成电路修改、沉积、失效点解剖、拍照、微细结构加工"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"FIB+EDSFIB测试SEM/EDX扫描电子显微镜形貌、成分、背散射电子成像"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"探针台电性能测试（IV、暗电流）、芯片检查（mapping）"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"IV曲线Probe针（硬针，常规）Probe针（软针）Probe测试"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"C-SAM超声波扫描电镜封装芯片密封性测试、芯片失效点定位红外热像仪普通扫描定位失效点高分辨扫描"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"开封激光开封用于定位失效点化学开封（金线）/去封装化学开封（非金线）/去封装（特殊封装BGA/CSP）化学开封-去除聚酰亚胺化学开封-去POLY取die"},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"color":"#9a9a9a"},"insert":"来源于米格实验室，作者米格实验室"},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"color":"var(--weui-FG-0)"},"insert":"半导体工程师"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"半导体经验分享，半导体成果交流，半导体信息发布。半导体行业动态，半导体从业者职业规划，芯片工程师成长历程。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"\n"}]