博捷芯 半导体工程师 2023-08-04 10:11 发表于北京
，时00:41
划片机是使用刀片，高精度地切断硅・玻璃・陶瓷等被加工物的装置。
全自动划片机是从装片、位置校准、切割、清洗\/干燥、到卸片为...
[{"attributes":{"color":"var(--weui-FG-2)"},"insert":"博捷芯"},{"insert":" "},{"attributes":{"color":"var(--weui-LINK)"},"insert":"半导体工程师"},{"insert":" "},{"attributes":{"color":"var(--weui-FG-2)"},"insert":"2023-08-04 10:11"},{"insert":" "},{"attributes":{"color":"var(--weui-FG-2)"},"insert":"发表于北京"},{"insert":"\n，时"},{"attributes":{"color":"#ffffff"},"insert":"00:41"},{"attributes":{"align":"center"},"insert":"\n"},{"insert":"划片机是使用刀片，高精度地切断硅・玻璃・陶瓷等被加工物的装置。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"全自动划片机是从装片、位置校准、切割、清洗/干燥、到卸片为止的一系列工序，可全部实现全自动化操作的装置。该机型配置了大功率对向式双主轴，Z1和Z2轴上都配置了NCS和专用显微镜，大幅度减少对准和检查时间，从而降低人工成本、提高生产效率。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":{"image":"https://files.eteforum.com/202308/d2fe06df3de28ff5.png"}},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"align":"center"},"insert":"\n\n"},{"insert":"半自动划片机是指被加工物的安装及卸载作业均采用手动方式进行，只有加工工序实施自动化操作的装置。"},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"align":"center"},"insert":"\n\n"},{"insert":"可用于集成电路QFN、压电陶瓷、发光二极管、分离器件、光通讯器件、LED芯片、热敏电阻、光学器件、陶瓷电路器件的划切分离加工。适用于硅、石英、玻璃、蓝宝石、氧化铝、氧化铁、砷化镓和铌酸锂等材料的划切加工。最大兼容8英寸-12英寸晶圆，具有单主轴和双主轴的机型。"},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"align":"center"},"insert":"\n"},{"attributes":{"align":"justify"},"insert":"\n\n"},{"insert":"LX6366型双轴晶圆切割机为12英寸全自动动精密划片机，采用高精密进口主要配件，T轴采用DD马达，重复精度1μm，稳定性极强，兼容6\"-12\"材料，双CCD视觉系统，性能达到业界一流水平"},{"attributes":{"align":"justify"},"insert":"\n\n"},{"attributes":{"bold":true},"insert":"\t设备工作流程："},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"\t1.下取物臂将待切割材料从晶片盒中取出，将待切割材料放置到预校准台进行预校准，再送到工作盘上，进行划片作业。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"\t2. 上取物臂从工作盘将切割完成的材料移动到清洗盘上，进行二流体清洗和晶片干燥。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"\t3 .下取物臂将切割完成的材料放回预校准台进行预校准，再推回晶片盒中。"},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"bold":true},"insert":"使用环境要求："},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"1.请使用大气压水汽结露点-15℃，油残存不大于0.1ppm，过滤度0.01μm/99.5%以上的洁净压缩空气"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"2.请将切削水及冷却水的水温为室温±2℃，水温控制在室温波动范围±1℃"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"3.避免把设备放置在有震动的工作环境工作，远离鼓风机、通风口、高温装置、油污等环境"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"4.室内温度20-25℃，温度变化不大于±1℃"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"5.工厂具有防水性底板"},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"color":"var(--weui-FG-0)"},"insert":"半导体工程师"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"半导体经验分享，半导体成果交流，半导体信息发布。半导体行业动态，半导体从业者职业规划，芯片工程师成长历程。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"\n"}]
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发表于 2023-08-04 13:09
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