精密划片机的三种切割方式

[{"attributes":{"color":"var(--weui-FG-2)"},"insert":"失效分析 赵工"},{"insert":" "},{"attributes":{"color":"#576b95"},"insert":"半导体工程师"},{"insert":" "},{"attributes":{"color":"var(--weui-FG-2)"},"insert":"2023-02-25 08:33"},{"insert":" "},{"attributes":{"color":"var(--weui-FG-2)"},"insert":"发表于北京"},{"insert":"\n\n划片机的种类主要分为三种：分别是全自动划片、半自动划片（包含自动识别、 手动识别）、手动划片。具体功能如下： "},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"全自动划片：是指在完成加工物模板教学的前提下，设备将对工作台上的加工物自动上料，自动识别，自动清洗，依据切割参数的设定，沿多个切割向连续地进行切割。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"半自动划片：对工作台上的加工物（确定切割位置）后，依据切割参数的设定，可进行自动识别或手动识别，沿多个切割向连续地进行切割。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"手动划片：选择一个切割向，对工作台上的加工物手动进行对准后，仅沿所选择的方向进行切割。半自动切割开始前，可指定切割方向（向前或者向 后），还可以指定切割条数。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":{"image":"https://files.eteforum.com/202302/57010147593fdfbc.png"}},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"1、全自动划片"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"在博捷芯半导体软件界面点击，进入界面全自动划片。 "},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":{"image":"https://files.eteforum.com/202302/5507ecaa1e939344.png"}},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"全自动切割中部区域显示信息说明： "},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"切割信息：切割使用的刀片、工件、切割设定参数等信息。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"底部功能区域按钮说明："},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"图形对准：可进入对准界面，验证自动识别功能。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"工件真空：开启或关闭工件真空。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"工件设定：如需更改工件数据，可通过底部<工件设定>按钮进行操作。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"预切割：切割前，可开启或关闭预切割功能。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"继续切割：点击此按钮，完成上次未完成的切割操作。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"右侧功能区域按钮说明："},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"START：执行自动识别操作并沿多个方向进行切割（需要在功能设置界面中，开启自动识别并切割功能）。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"2、半自动划片"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"单击博捷芯界面点击半自动划片后，再点击自动识别按钮，进入界面自动划片："},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":{"image":"https://files.eteforum.com/202302/0308a57039fcf130.png"}},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"自动识别：选择工件后自动识别对准（在执行自动识别前，需要事先进行目标识别制作）。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"手动识别：此处指单向对准，在指定的切割方向上，通过观察图像的位置，以手动方式确定切割位置。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"点击高倍和低倍相互切换。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"画面可点击移动状态。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"画面锁住状态。 "},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"显示紫色实线状态和通过可调紫色实线基准线的宽度。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"显示绿色虚线状态，和通过可调绿色虚线基准线的宽度。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"3、手动划片"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"博捷芯界面点击半自动划片后，点击手动划片按钮后，进入界面手动划片："},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":{"image":"https://files.eteforum.com/202302/7c83c6f92fa1c891.png"}},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"划片刀数（0=ALL）：输入切割的总刀数，默认为0，则按最大刀数切割。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"向后划片：点选此按钮后，手动切割方向为从前向后切割。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"向前划片：点选此按钮后，手动切割方向为从后向前切割。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"T轴调整：调整切割道与基准线平行，先找到切割道一个目标，点击T轴调整，X轴自动移动另外一端，找到同一条切割道的目标，再点击T轴调整，此时切割道与基准线处于平行。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"划片面：可选择CH1或CH2。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"高度校正：在划片参数里刀片高度的设定下，输入数值可抬高或降低刀片高度。输入修改的高度后，点击F2刀片高度校正。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"进刀速度更新：当前划片过程输入速度可修改速度大小，输入修改的速度 后，点击F7划片速度更新。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"偏移量：输入偏移数值，数值为正往前偏移，数值为负往后偏移，0则不偏移。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":{"image":"https://files.eteforum.com/202302/d38d2a9a3c7a6922.png"}},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"来源：博捷芯精密划片机"},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"color":"var(--weui-FG-0)"},"insert":"半导体工程师"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"半导体经验分享，半导体成果交流，半导体信息发布。半导体行业动态，半导体从业者职业规划，芯片工程师成长历程。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"\n"}]