失效分析 赵工 半导体元器件失效分析可靠性测试
半导体芯片是战略性，先导性行业，目前北方市场急需完善的第三方实验室，专业的技术，成套的检测设备，为满足用户检测多样化，就近服务的要求...
[{"attributes":{"color":"var(--weui-FG-2)"},"insert":"失效分析 赵工"},{"insert":" "},{"attributes":{"color":"#576b95"},"insert":"半导体元器件失效分析可靠性测试"},{"insert":" "},{"attributes":{"header":1},"insert":"\n"},{"insert":"\n半导体芯片是战略性，先导性行业，目前北方市场急需完善的第三方实验室，专业的技术，成套的检测设备，为满足用户检测多样化，就近服务的要求，我中心专门安装了高精度x-ray检测设备，目前X-ray(X光无损检测)已经全面对外服务，机时充足。"},{"attributes":{"align":"justify"},"insert":"\n\n"},{"insert":{"image":"https://community-1252773949.cos.ap-guangzhou.myqcloud.com/2032/4f74e8de906d2e5c.png"}},{"attributes":{"align":"center"},"insert":"\n"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"一、X-ray是什么？"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":" "},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"X-ray是利用阴极射线管产生高能量电子与金属靶撞击，在撞击过程中，因电子突然减速，其损失的动能会以X-Ray形式放出。而对于样品无法以外观方式观测的位置，利用X-Ray穿透不同密度物质后其光强度的变化，产生的对比效果可形成影像，即可显示出待测物的内部结构，进而可在不破坏待测物的情况下观察待测物内部有问题的区域。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":{"image":"https://community-1252773949.cos.ap-guangzhou.myqcloud.com/2032/872b644433f88e55.jpg"}},{"attributes":{"align":"justify"},"insert":"\n\n"},{"insert":"二、X-ray能做什么事？"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":" "},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"高精度X-ray是无损检测重要方法，失效分析常用方式，主用应用领域有："},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":" "},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"1. 观测DIP、SOP、QFP、QFN、BGA、Flipchip等不同封装"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":" "},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"的半导体、电阻、电容等电子元器件以及小型PCB印刷电路板"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":" "},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"2. 观测器件内部芯片大小、数量、叠die、绑线情况"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":" "},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"3. 观测芯片crack、点胶不均、断线、搭线、内部气泡等封装"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":" "},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"缺陷，以及焊锡球冷焊、虚焊等焊接缺陷"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":" "},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"三、X-ray(X光无损检测)招募范围："},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":" "},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"1. 境内外企事业单位，团体，个人均可。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":" "},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"产品研发，样品试制，失效分析，过程监控和大批量产品观测。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":" "},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"X-ray(X光无损检测)招募要求："},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":" "},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"1. 方案完整，清晰，明确。写清样品情况，数量，测试要求。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":" "},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"样品小于30cm。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":" "},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"四、X-ray(X光无损检测)招募时间："},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":" "},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"2022年10月27日-2023年8月8日。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":" "},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"样品以收到时间为准，方案以邮件时间为准。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":" "},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"五、X-ray(X光无损检测)注意事项："},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":" "},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"1. 受样品本身，方案，设备，操作，经验，运输，时效等多方面因素影响，X-ray不保证每个方案都能找到原因，对结果要求苛刻的用户请不要参与。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":" "},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"2. X-ray(X光无损检测)所需周期一个工作日左右。测试完成的方案会第一时间反馈给用户，并安排快递送回样品。 "},{"attributes":{"align":"justify"},"insert":"\n\n"},{"attributes":{"color":"var(--weui-FG-0)"},"insert":"半导体工程师"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"半导体经验分享，半导体成果交流，半导体信息发布。半导体行业动态，半导体从业者职业规划，芯片工程师成长历程。"},{"attributes":{"align":"justify"},"insert":"\n\n\n"},{"insert":"\n"}]
-
发表于 2022-10-27 14:21
- 阅读 ( 806 )
