失效分析 赵工 半导体工程师 2022-12-16 09:15 发表于北京
美东时间周四,美国政府将长江存储、寒武纪、上海微电子装备等在内的36家中国科技公司列入了“实体清单”,以期进一步阻挠和打压中国科...
[{"attributes":{"color":"var(--weui-FG-2)"},"insert":"失效分析 赵工"},{"insert":" "},{"attributes":{"color":"#576b95"},"insert":"半导体工程师"},{"insert":" "},{"attributes":{"color":"var(--weui-FG-2)"},"insert":"2022-12-16 09:15"},{"insert":" "},{"attributes":{"color":"var(--weui-FG-2)"},"insert":"发表于北京"},{"insert":"\n"},{"attributes":{"color":"#333333","size":"small"},"insert":"美东时间周四,美国政府将长江存储、寒武纪、上海微电子装备等在内的36家中国科技公司列入了“实体清单”,以期进一步阻挠和打压中国科技行业的发展。"},{"attributes":{"align":"justify","header":1},"insert":"\n"},{"insert":"美国商务部将这些公司列入所谓的实体清单,意味着上述任何公司如果对名单上企业提供的产品涉及美国技术,必须获得华盛顿方面的许可,而这个许可证很难申请成功。"},{"attributes":{"align":"justify"},"insert":"\n\n"},{"attributes":{"color":"#999999"},"insert":{"image":"https://community-1252773949.cos.ap-guangzhou.myqcloud.com/2034/993556b88483d675.png"}},{"attributes":{"color":"#999999"},"insert":"(来源:美国商务部)"},{"attributes":{"align":"center"},"insert":"\n"},{"insert":"最新的举措是美国企图限制中国芯片和人工智能技术发展的一部分,在10月份,拜登政府公布了限制美国公司向中国出售产品的全面措施,且美国一直在推动盟国配合这一计划。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"美国参议院民主党领袖查克·舒默直言要限制中国科技的发展,他表示,拜登政府需要迅速采取行动,要防止长江存储等企业获得哪怕一英寸的军事或经济优势。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"中国驻华盛顿大使馆表示,美国正在进行公然的经济胁迫和技术领域的霸凌,破坏中美企业之间的正常商业活动,威胁全球供应链的稳定。中方将坚决维护中国企业和机构的合法权益。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"此前已有报道称,上述企业将被列入禁止购买部分美国零部件的实体清单。在周三的中国外交部例行记者会上,外交部发言人汪文斌指出,美方一再泛化国家安全概念、滥用出口管制措施、对他国企业采取歧视性、不公平做法,将经贸科技问题政治化、武器化,这是赤裸裸的经济胁迫和科技霸凌行径。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"汪文斌表示,美方做法严重损害中美企业间正常经贸往来合作,严重破坏市场规则和国际经贸秩序,严重威胁全球产业链供应链稳定,这不利于中美两国,也不利于世界。中方将坚决维护中国企业和机构的合法权益。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"添加到实体名单中的36家公司具体如下:"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Anhui Cambricon Information Technology Co., Ltd.(安徽寒武纪信息科技有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"AVIC Research Institute for Special Structures of Aeronautical Composites(中国航空工业集团公司复合材料特种结构研究所)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"AZUP International Group Co., Ltd.(安洲国际集团有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Beijing HiFar Technology Co., Ltd.(北京华天海峰科技股份有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Beijing Machinery Industry Automation Research Institute Co., Ltd.(北京机械工业自动化研究所有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Beijing UniStrong Science & Technology Co., Ltd.(北京合众思壮科技股份有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Beijing Vision Strategy Technology Co., Ltd.(北京银景科技有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Cambricon (Hong Kong) Co., Ltd.(寒武纪(香港)有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Cambricon (Kunshan) Information Technology Co., Ltd.(寒武纪(昆山)信息技术有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Cambricon Jixingge (Nanjing) Technology Co., Ltd.(寒武纪(南京)科技有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Cambricon (Nanjing) Information Technology Co., Ltd.(寒武纪(南京)信息技术有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Cambricon Technologies Corporation Limited(寒武纪科技股份有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Cambricon (Xi’an) Integrated Circuit Co., Ltd.(寒武纪(西安)集成电路有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"CETC Cloud (Beijing) Technology Co., Ltd.(电科云(北京)科技有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"CETC LES Information System Group Co., Ltd.(中电莱斯信息系统有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"China Electronics Technology Group Corporation No. 28 Institute(中国电子科技集团公司第二十八研究所)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Chinese Academy of Sciences Institute of Computing Technology(中国科学院计算技术研究所)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Guangdong Qinzhi Technology Research Institute Co., Ltd.(广东琴智科技研究院有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Hefei Core Storage Electronic Ltd.(合肥兆芯电子有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Key Laboratory of Information Systems Engineering(信息系统工程重点实验室)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Nanjing Aixi Information Technology Co., Ltd.(南京艾溪信息科技有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Nanjing LES Cybersecurity and Information Technology Research Institute Co., Ltd.(南京莱斯网信技术研究院有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Nanjing LES Electronic Equipment Co., Ltd.(南京莱斯电子设备有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Nanjing LES Information Technology Co., Ltd.(南京莱斯信息技术股份有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"PXW Semiconductor Manufactory Co., Ltd.(深圳市鹏芯微集成电路制造有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Shanghai Cambricon Information Technology Co., Ltd.(上海寒武纪信息科技有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Shanghai Integrated Circuit Research and Development Center(上海集成电路研发中心)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Shanghai Micro Electronics Equipment (Group) Co., Ltd.(上海微电子装备(集团)股份有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Shanghai Suowei Information Technology Co., Ltd.(上海索为信息科技有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Suzhou Cambricon Information Technology Co., Ltd.(苏州寒武纪信息科技有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"System Equipment Co., Ltd. of the 28th Research Institute (Liyang)(溧阳二十八所系统装备有限公司 )"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Tianjin Tiandi Weiye Technologies Co., Ltd.(天津天地伟业科技有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Xiong’an Cambricon Technology Co., Ltd.(雄安寒武纪科技有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Yangtze Memory Technologies Co., Ltd.(长江存储科技有限责任公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Zhongke Xinliang (Beijing) Technology Co., Ltd.(北京中科新联科技有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"Yangtze Memory Technologies (Japan) Inc.(长江存储技术(日本)有限公司)"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"来源:是说芯语"},{"attributes":{"align":"justify"},"insert":"\n"},{"attributes":{"color":"var(--weui-FG-0)"},"insert":"半导体工程师"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"半导体经验分享,半导体成果交流,半导体信息发布。半导体行业动态,半导体从业者职业规划,芯片工程师成长历程。"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"55篇原创内容"},{"attributes":{"align":"justify"},"insert":"\n"},{"insert":"公众号"},{"attributes":{"align":"justify"},"insert":"\n\n"},{"insert":"\n"}]
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发表于 2022-12-16 10:11
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